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Sekisui Chemical Singapore (Pte.) Ltd.
Plastic Core Solder Balls   Conductive Fine Particles
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Assembly Applications Conductive Fine Particles
About gap holding ability
It doesn't occur to transform below the core size.SOL holds ideally gap between board and package.
The rate of keeping gap :97.1%
Particle size before mounting : 800
Gap size after mounting : 777
It shows excellent reliability because of a uniform plastic core.
About holding transmission line
Because SOL doesn't transform below own core size, the transmission line is not out of order from a design value.
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